I-HK-04G AT

Isicelo sokushintsha: sisetshenziswa kakhulu ezintweni zasendlini ezahlukahlukene, okokusebenza kwe-elekthronikhi, okokusebenza ezishintshayo, okokusebenza kwezokuxhumana, ugesi wezimoto, amathuluzi kagesi neminye imikhakha.


I-HK-04G AT

ividiyo

Omaka bomkhiqizo

Shintsha Izimpawu zesenzo

Izici ezichazayo zokusebenza Ipharamitha esebenzayo Isifinyezo Amayunithi Inani
Isikhundla samahhala FP mm 12.1±0.2
Isikhundla sokuSebenza OP mm 11.5±0.5
Ukukhulula Isikhundla RP mm 11.7±0.5
Ingqikithi Yendawo Yokuhamba I-TTP mm 10.7
Amandla Okusebenza OF N 1.0~3.5
Ukukhulula Amandla RF N -
Ingqikithi Yokuhamba I-TTF N -
Ngaphambi Kokuhamba PT mm 0.3~1.0
Over Travel OT mm 0.2Miz
Umehluko Wokunyakaza MD mm 0.4Ubukhulu

Shintsha Izimpawu zobuchwepheshe

INTO ipharamitha yezobuchwepheshe Inani
1 Isilinganiso sikagesi 5A/10A 250VAC
2 Xhumana Nokumelana ≤50mΩ Inani lokuqala
3 I-Insulation Resistance ≥100MΩ500VDC
4 I-Dielectric Voltage phakathi kwamatheminali angaxhumekile 500V/0.5mA/60S
phakathi kwamatheminali nohlaka lwensimbi 1500V/0.5mA/60S
5 Ukuphila kukagesi ≥10000 imijikelezo
6 Impilo Yemishini ≥100000 imijikelezo
7 Izinga Lokushisa Lokusebenza 0 ~ 125℃
8 Imvamisa Yokusebenza kagesi:15imijikelezoUmakhenikha:60imijikelezo
9 Ubufakazi bokudlidliza Imvamisa yokudlidliza:10 ~ 55HZ;
Ubukhulu: 1.5mm;
Izindlela ezintathu: 1H
10 Amandla e-Solder: Ngaphezu kwe-80% yengxenye ecwilisiwe izombozwa nge-solder Izinga Lokushisa Lokuhlanganisa:235±5℃Isikhathi Sokucwiliswa:2~3S
11 Ukumelana Nokushisa Kwe-Solder I-Dip Soldering:260±5℃ 5±1SManual Soldering:300±5℃ 2~3S
12 Izimvume Zokuphepha UL,CSA,VDE,ENEC,CE
13 Izimo Zokuhlola I-Ambient Temperature:20±5℃ Isihlobo
Ukuswakama:65±5%RH
Ingcindezi Yomoya:86~106KPa

Isicelo sokushintsha: sisetshenziswa kakhulu ezintweni zasendlini ezahlukahlukene, okokusebenza kwe-elekthronikhi, okokusebenza ezishintshayo, okokusebenza kwezokuxhumana, ugesi wezimoto, amathuluzi kagesi neminye imikhakha.


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