HK-04G AT

Isicelo sokutshintsha: sisetyenziswa kakhulu kwizixhobo zasekhaya ezahlukeneyo, izixhobo zombane, izixhobo ezizisebenzelayo, izixhobo zonxibelelwano, izixhobo zombane zeemoto, izixhobo zombane kunye namanye amacandelo.


HK-04G AT

ividiyo

Iithegi zeMveliso

Tshintsha izenzo zeempawu

Iimpawu ezichazayo zokusebenza IParameter yokuSebenza Ushunqulelo Iiyunithi Ixabiso
Isikhundla sasimahla FP mm 12.1±0.2
Isikhundla sokuSebenza OP mm 11.5±0.5
Ukukhulula Isikhundla RP mm 11.7±0.5
Indawo yohambo iyonke TTP mm 10.7
Amandla okusebenza OF N 1.0~3.5
Ukukhulula amandla RF N -
Amandla ohambo olupheleleyo TTF N -
Ukuhamba kwangaphambili PT mm 0.3~1.0
Ukuhamba ngaphezulu OT mm 0.2Miz
Ukushukuma Umahluko MD mm 0.4 Ubuninzi

Tshintsha iiMpawu zezobugcisa

INTO ipharamitha yobugcisa Ixabiso
1 Ukulinganisa koMbane 5A/10A 250VAC
2 Qhagamshelana Ukuchasa ≤50mΩIxabiso lokuqala
3 I-Insulation Resistance ≥100MΩ500VDC
4 Umbane weDielectric phakathi kweetheminali ezingadityaniswanga 500V/0.5mA/60S
phakathi kweetheminali kunye nesakhelo sesinyithi 1500V/0.5mA/60S
5 Ubomi boMbane ≥10000 imijikelo
6 Ubomi boomatshini ≥100000 imijikelo
7 Ubushushu bokusebenza 0 ~ 125℃
8 Ukuphindaphinda okuSebenzayo zombane:15imijikeloOomatshini:60imijikelo
9 Ubungqina bokungcangcazela Ukungcangcazela Frequency:10~55HZ;
Ubungakanani: 1.5mm;
Iindlela ezintathu:1H
10 Amandla eSolder: Ngaphezu kwe-80% yenxalenye entywilisiweyo iya kugqunywa ngesolder Ubushushu beSoldering:235±5℃Ixesha lokuntywiliselwa:2~3S
11 I-Solder Heat Resistance Dip Soldering:260±5℃ 5±1SManual Soldering:300±5℃ 2~3S
12 Izamkelo zoKhuseleko UL,CSA,VDE,ENEC,CE
13 Iimeko zovavanyo Ubushushu be-Ambient:20±5℃ Isihlobo
Ukufuma: 65±5%RH
Uxinzelelo loMoya: 86 ~ 106KPa

Isicelo sokutshintsha: sisetyenziswa kakhulu kwizixhobo zasekhaya ezahlukeneyo, izixhobo zombane, izixhobo ezizisebenzelayo, izixhobo zonxibelelwano, izixhobo zombane zeemoto, izixhobo zombane kunye namanye amacandelo.


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