GNY51-1-05
Limit Switch Stroke PUSH Slug Column Micro switches Blue 1NO 1NC e betere ho feta LXW20-11
GNY51-1-05
(Fetola ttsa botekgenikiLitšobotsi):
| （ITEM） | (parameter ea tekheniki) | （Boleng） | |
| 1 | (Tlhahiso ea Motlakase) | 10A 250VAC | |
| 2 | (Contact Resistance) | ≤50mΩ( Boleng ba pele) | |
| 3 | (Insulation Resistance) | ≥100MΩ(500VDC) | |
| 4 | (Dielectric Voltage) | (pakeng tsa li-terminals tse sa hokahaneng) | 500V/0.5mA/60S |
| (pakeng tsa li-terminals le foreimi ea tšepe) | 1500V/0.5mA/60S | ||
| 5 | (Bophelo ba Motlakase) | ≥50000 lipotoloho | |
| 6 | (Bophelo ba Mechini) | ≥100000 lipotoloho | |
| 7 | (Mocheso oa ho sebetsa) | 0～125℃ | |
| 8 | (Makhetlo a ho sebetsa) | (motlakase):15lipotoloho(Mechini):60lipotoloho | |
| 9 | (Bopaki ba Vibration) | (Makhetlo a Vibration): 10 ~ 55HZ; (Amplitude): 1.5mm; (Litsela tse tharo): 1H | |
| 10 | (Bokhoni ba Solder): (Ho feta 80% ea karolo e qoelitsoeng e tla koaheloa ka solder) | (Mocheso oa Soldering): 235±5℃(Nako ea ho qoelisoa):2～3S | |
| 11 | (Solder Heat Resistance) | (Dip Soldering): 260±5℃ 5±1S(Manual Soldering):300±5℃ 2～3S | |
| 12 | (Litumello tsa Tšireletso) | UL, CSA, TUV, CQC, CE | |
| 13 | (Maemo a Teko) | (Ambient Mocheso):20±5℃ (Mongobo o Relative）:65±5%RH(Khatello ea Moea):86～106KPa | |
Tšebeliso le tlhokomelo
(1) Sheba konopo khafetsa ho tlosa litšila ho eona.Ka lebaka la sebaka se senyenyane pakeng tsa mabitso a konopo, ka mor'a lilemo tse ngata tsa tšebeliso kapa tiiso ha e ntle, ho phalla ha lerōle kapa mekhahlelo e sa tšoaneng ea emulsion ea oli ea enjene ho tla etsa hore ho behoa ho fokotsehe kapa esita le kotsi e khutšoanyane ea potoloho.Tabeng ena, ho kenya letsoho le ho hloekisa ho tlameha ho etsoa, 'me mehato e lumellanang ea ho tiisa e tlameha ho nkoa.
(2) Ha konopo e sebelisoa sebakeng sa mocheso o phahameng, ho bonolo ho holofatsa le ho tsofala ha polasetiki, ho etsa hore konopo e theohe, e leng se bakang potoloho e khutšoanyane pakeng tsa li-screws.Ho ea ka maemo, selikalikoe sa ho tiisa se ka eketsoa ho se tiisa hore se sebelisoe nakong ea ho kenya, kapa tube ea polasetiki e sireletsang e ka kenngoa holim'a sekoti sa wiring ho thibela ho lokoloha.
(3) Bakeng sa konopo e nang le leseli la leseli, tleloubu e tla futhumatsa, 'me lebone la polasetiki le tla holofala ka nako e telele, e leng se tla etsa hore ho be thata ho khutlisa tleloubu.Ka hona, ha ea tšoanela ho sebelisoa libakeng tseo matla a leng teng ka nako e telele;haeba u batla ho e sebelisa, u ka theola motlakase oa bulb ka nepo ho lelefatsa bophelo ba eona.
(4) Haeba ho kopana ho futsanehileng ho fumanoa, lebaka le lokela ho batlisisoa: haeba sebaka sa ho kopana se senyehile, se ka lokisoa ka faele e ntle;haeba ho na le litšila kapa mosili holim'a sefahleho sa ho kopana, se lokela ho hlakoloa ka lesela le hloekileng la k'hothone le kenngoeng ka solvent;haeba e le seliba sa ho kopana Haeba se hlōleha, se lokela ho nkeloa sebaka;haeba ho kopana ho chesoa ka matla, sehlahisoa se lokela ho nkeloa sebaka.
GNY51-1-01
(Fetola ttsa botekgenikiLitšobotsi):
| （ITEM） | (parameter ea tekheniki) | （Boleng） | |
| 1 | (Tlhahiso ea Motlakase) | 10A 250VAC | |
| 2 | (Contact Resistance) | ≤50mΩ( Boleng ba pele) | |
| 3 | (Insulation Resistance) | ≥100MΩ(500VDC) | |
| 4 | (Dielectric Voltage) | (pakeng tsa li-terminals tse sa hokahaneng) | 500V/0.5mA/60S |
| (pakeng tsa li-terminals le foreimi ea tšepe) | 1500V/0.5mA/60S | ||
| 5 | (Bophelo ba Motlakase) | ≥50000 lipotoloho | |
| 6 | (Bophelo ba Mechini) | ≥100000 lipotoloho | |
| 7 | (Mocheso oa ho sebetsa) | 0～125℃ | |
| 8 | (Makhetlo a ho sebetsa) | (motlakase):15lipotoloho(Mechini):60lipotoloho | |
| 9 | (Bopaki ba Vibration) | (Makhetlo a Vibration): 10 ~ 55HZ; (Amplitude): 1.5mm; (Litsela tse tharo): 1H | |
| 10 | (Bokhoni ba Solder): (Ho feta 80% ea karolo e qoelitsoeng e tla koaheloa ka solder) | (Mocheso oa Soldering): 235±5℃(Nako ea ho qoelisoa):2～3S | |
| 11 | (Solder Heat Resistance) | (Dip Soldering): 260±5℃ 5±1S(Manual Soldering):300±5℃ 2～3S | |
| 12 | (Litumello tsa Tšireletso) | UL, CSA, TUV, CQC, CE | |
| 13 | (Maemo a Teko) | (Ambient Mocheso):20±5℃ (Mongobo o Relative）:65±5%RH(Khatello ea Moea):86～106KPa | |
GNY51-1-02
(Fetola ttsa botekgenikiLitšobotsi):
| （ITEM） | (parameter ea tekheniki) | （Boleng） | |
| 1 | (Tlhahiso ea Motlakase) | 10A 250VAC | |
| 2 | (Contact Resistance) | ≤50mΩ( Boleng ba pele) | |
| 3 | (Insulation Resistance) | ≥100MΩ(500VDC) | |
| 4 | (Dielectric Voltage) | (pakeng tsa li-terminals tse sa hokahaneng) | 500V/0.5mA/60S |
| (pakeng tsa li-terminals le foreimi ea tšepe) | 1500V/0.5mA/60S | ||
| 5 | (Bophelo ba Motlakase) | ≥50000 lipotoloho | |
| 6 | (Bophelo ba Mechini) | ≥100000 lipotoloho | |
| 7 | (Mocheso oa ho sebetsa) | 0～125℃ | |
| 8 | (Makhetlo a ho sebetsa) | (motlakase):15lipotoloho(Mechini):60lipotoloho | |
| 9 | (Bopaki ba Vibration) | (Makhetlo a Vibration): 10 ~ 55HZ; (Amplitude): 1.5mm; (Litsela tse tharo): 1H | |
| 10 | (Bokhoni ba Solder): (Ho feta 80% ea karolo e qoelitsoeng e tla koaheloa ka solder) | (Mocheso oa Soldering): 235±5℃(Nako ea ho qoelisoa):2～3S | |
| 11 | (Solder Heat Resistance) | (Dip Soldering): 260±5℃ 5±1S(Manual Soldering):300±5℃ 2～3S | |
| 12 | (Litumello tsa Tšireletso) | UL, CSA, TUV, CQC, CE | |
| 13 | (Maemo a Teko) | (Ambient Mocheso):20±5℃ (Mongobo o Relative）:65±5%RH(Khatello ea Moea):86～106KPa | |
GNY51-2-200
Fetola Litšobotsi tsa tekheniki
GNY51
(Fetola ttsa botekgenikiLitšobotsi):
| （ITEM） | (parameter ea tekheniki) | （Boleng） | |
| 1 | (Tlhahiso ea Motlakase) | 10A 250VAC | |
| 2 | (Contact Resistance) | ≤50mΩ( Boleng ba pele) | |
| 3 | (Insulation Resistance) | ≥100MΩ(500VDC) | |
| 4 | (Dielectric Voltage) | (pakeng tsa li-terminals tse sa hokahaneng) | 500V/0.5mA/60S |
| (pakeng tsa li-terminals le foreimi ea tšepe) | 1500V/0.5mA/60S | ||
| 5 | (Bophelo ba Motlakase) | ≥50000 lipotoloho | |
| 6 | (Bophelo ba Mechini) | ≥100000 lipotoloho | |
| 7 | (Mocheso oa ho sebetsa) | 0～125℃ | |
| 8 | (Makhetlo a ho sebetsa) | (motlakase):15lipotoloho(Mechini):60lipotoloho | |
| 9 | (Bopaki ba Vibration) | (Makhetlo a Vibration): 10 ~ 55HZ; (Amplitude): 1.5mm; (Litsela tse tharo): 1H | |
| 10 | (Bokhoni ba Solder): (Ho feta 80% ea karolo e qoelitsoeng e tla koaheloa ka solder) | (Mocheso oa Soldering): 235±5℃(Nako ea ho qoelisoa):2～3S | |
| 11 | (Solder Heat Resistance) | (Dip Soldering): 260±5℃ 5±1S(Manual Soldering):300±5℃ 2～3S | |
| 12 | (Litumello tsa Tšireletso) | UL, CSA, TUV, CQC, CE | |
| 13 | (Maemo a Teko) | (Ambient Mocheso):20±5℃ (Mongobo o Relative):65±5%RH (Khatello ea Moea): 86 ~ 106KPa | |
