I-HK-04G-LD
Shintsha Izimpawu zesenzo
| Izici ezichazayo zokusebenza | Ipharamitha esebenzayo | Isifinyezo | Amayunithi | Inani |
 | Isikhundla samahhala | FP | mm | 12.1±0.2 |
| Isikhundla sokuSebenza | OP | mm | 11.5±0.5 | |
| Ukukhulula Isikhundla | RP | mm | 11.7±0.5 | |
| Ingqikithi Yendawo Yokuhamba | I-TTP | mm | 10.5±0.3 | |
| Amandla Okusebenza | OF | N | 1.0~3.5 | |
| Ukukhulula Amandla | RF | N | - | |
| Ingqikithi Yokuhamba | I-TTF | N | - | |
| Ngaphambi Kokuhamba | PT | mm | 0.3~1.0 | |
| Over Travel | OT | mm | 0.2Miz | |
| Umehluko Wokunyakaza | MD | mm | 0.4Ubukhulu |
Shintsha Izimpawu zobuchwepheshe
| INTO | ipharamitha yezobuchwepheshe | Inani | |
| 1 | Isilinganiso sikagesi | 52A 250VAC | |
| 2 | Xhumana Nokumelana | ≤50mΩ Inani lokuqala | |
| 3 | I-Insulation Resistance | ≥100MΩ500VDC | |
| 4 | I-Dielectric Voltage | phakathi kwamatheminali angaxhumekile | 500V/0.5mA/60S |
| phakathi kwamatheminali nohlaka lwensimbi | 1500V/0.5mA/60S | ||
| 5 | Ukuphila kukagesi | ≥10000 imijikelezo | |
| 6 | Impilo Yemishini | ≥100000 imijikelezo | |
| 7 | Izinga Lokushisa Lokusebenza | -25 ~ 125 ℃ | |
| 8 | Imvamisa Yokusebenza | kagesi:15imijikelezo Umakhenikha:60imijikelezo | |
| 9 | Ubufakazi bokudlidliza | Imvamisa yokudlidliza:10~55HZ; Ubukhulu: 1.5mm; Izindlela ezintathu: 1H | |
| 10 | Amandla e-Solder: Ngaphezu kwe-80% yengxenye ecwilisiwe izombozwa nge-solder | I-Soldering Temperature:235±5℃ Isikhathi Sokucwiliswa:2~3S | |
| 11 | Ukumelana Nokushisa Kwe-Solder | I-Dip Soldering:260±5℃ 5±1S Ukugoqa ngesandla:300±5℃ 2~3S | |
| 12 | Izimvume Zokuphepha | UL,CSA,VDE,ENEC,CE | |
| 13 | Izimo Zokuhlola | I-Ambient Temperature:20±5℃ Ukuswakama Okuhlobene:65±5%RH Ingcindezi Yomoya:86~106KPa | |
Isicelo sokushintsha: sisetshenziswa kakhulu ezintweni zasendlini ezahlukahlukene, okokusebenza kwe-elekthronikhi, okokusebenza ezishintshayo, okokusebenza kwezokuxhumana, ugesi wezimoto, amathuluzi kagesi neminye imikhakha.
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Bhala umlayezo wakho lapha futhi usithumelele wona
