I-DK4-BZ-019


I-DK4-BZ-019

ividiyo

Omaka bomkhiqizo

(Izici ezichazayo zokusebenza)

(Ipharamitha esebenzayo)

(Isifinyezo)

(Amayunithi)

 pdd

(Isikhundla samahhala)

FP

mm

(Isikhundla sokuSebenza)

OP

mm

(Isikhundla Sokukhipha)

RP

mm

(Inani lendawo yokuhamba)

I-TTP

mm

(Amandla Okusebenza)

OF

N

(Amandla Okukhipha)

RF

N

(Ingqikithi Yamandla Okuvakasha)

I-TTF

N

(Ngaphambi Kokuhamba)

PT

mm

(Ngaphezu Kohambo)

OT

mm

(Umehluko Wokunyakaza)

MD

mm

Shintsha Izimpawu zobuchwepheshe

(INTO

(ipharamitha yezobuchwepheshe)

(Inani

1

(Isilinganiso sikagesi) 10(1.5)A 250VAC

2

(Ukumelana Nokuxhumana) ≤50mΩ( Inani lokuqala)

3

(I-Insulation Resistance) ≥100MΩ(500VDC)

4

(I-Dielectric Voltage) (phakathi kwamatheminali angaxhumekile) 500V/0.5mA/60S
(phakathi kwamatheminali nohlaka lwensimbi) 1500V/0.5mA/60S

5

(Impilo kagesi) ≥10000 imijikelezo

6

(Impilo Yemishini) ≥3000000 imijikelezo

7

(Izinga lokushisa elisebenzayo) -25℃105℃

8

(Imvamisa yokusebenza) (Ekagesi):15imijikelezo(Omakhenikha):60imijikelezo

9

(Ubufakazi bokudlidliza)

(Imvamisa yokudlidliza):10-55HZ;

(Amplitude):1.5mm;

(Izikhombisi-ndlela ezintathu): 1H

10

(Ikhono le-Solder): (Ingxenye engaphezu kuka-80% yengxenye ecwilisiwe izombozwa nge-solder) (Ithempelesha Yokuhlanganisa):235±5℃(Isikhathi Sokucwiliswa):2~3S

11

(I-Solder Heat Resistance) (I-Dip Soldering):260±5℃ 5±1S(Ukusoda Ngesandla):300±5℃ 2~3S

12

(Izimvume Zokuphepha)

I-UL, CSA, TUV,ENEC

13

(Izimo Zokuhlola) (Ithempelesha ye-Ambient):20±5℃ (Umswakama Ohlobene):65±5%RH

(Ingcindezi Yomoya):86–106KPa


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  • Olandelayo:

  • 11

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