HK-04G-LD
Yipada igbese Abuda
| Awọn ẹya ara ẹrọ asọye ti isẹ | Parameter iṣẹ | Kukuru | Awọn ẹya | Iye |
 | Ipo ọfẹ | FP | mm | 12.1 ± 0.2 |
| Ipo Iṣiṣẹ | OP | mm | 11.5 ± 0.5 | |
| Ipo idasilẹ | RP | mm | 11.7 ± 0.5 | |
| Lapapọ ipo irin ajo | TTP | mm | 10.5 ± 0.3 | |
| Agbara Iṣiṣẹ | OF | N | 1.0 ~ 3.5 | |
| Tu silẹ Force | RF | N | - | |
| Total ajo Force | TTF | N | - | |
| Ṣaaju Irin-ajo | PT | mm | 0.3 ~ 1.0 | |
| Lori Irin-ajo | OT | mm | 0.2 min | |
| Iyatọ gbigbe | MD | mm | 0.4 ti o pọju |
Yipada imọ Abuda
| Nkan | imọ paramita | Iye | |
| 1 | Itanna Rating | 52A 250VAC | |
| 2 | Olubasọrọ Resistance | ≤50mΩIye akọkọ | |
| 3 | Idabobo Resistance | ≥100MΩ500VDC | |
| 4 | Dielectric Foliteji | laarin ti kii-ti sopọ ebute | 500V / 0.5mA / 60S |
| laarin awọn ebute oko ati irin fireemu | 1500V/0.5mA/60S | ||
| 5 | Itanna Life | ≥10000 iyipo | |
| 6 | Mechanical Life | ≥100000 iyipo | |
| 7 | Awọn iwọn otutu ti nṣiṣẹ | -25 ~ 125 ℃ | |
| 8 | Igbohunsafẹfẹ Ṣiṣẹ | itanna:15awọn iyipo Mechanical:60awọn iyipo | |
| 9 | Ẹri gbigbọn | Igbohunsafẹfẹ Igbohunsafẹfẹ: 10 ~ 55HZ; Iwọn titobi: 1.5mm; Awọn itọnisọna mẹta: 1H | |
| 10 | Agbara Solder: Diẹ sii ju 80% ti apakan immersed yoo wa ni bo pelu solder | Awọn iwọn otutu tita: 235 ± 5 ℃ Akoko Ibọmi: 2 ~ 3S | |
| 11 | Solder Heat Resistance | Dip Soldering:260±5℃ 5±1S Soldering Afowoyi: 300± 5℃ 2 ~ 3S | |
| 12 | Awọn Ifọwọsi Aabo | UL, CSA, VDE, ENEC, CE | |
| 13 | Awọn ipo Idanwo | Iwọn otutu ibaramu: 20± 5℃ Ọriniinitutu ibatan: 65± 5% RH Agbara afẹfẹ: 86 ~ 106KPa | |
Ohun elo Yipada: lilo pupọ ni ọpọlọpọ awọn ohun elo ile, ohun elo itanna, ohun elo adaṣe, ohun elo ibaraẹnisọrọ, ẹrọ itanna, awọn irinṣẹ agbara ati awọn aaye miiran.
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Kọ ifiranṣẹ rẹ nibi ki o si fi si wa
