HK-04G AD

Ohun elo Yipada: lilo pupọ ni ọpọlọpọ awọn ohun elo ile, ohun elo itanna, ohun elo adaṣe, ohun elo ibaraẹnisọrọ, ẹrọ itanna, awọn irinṣẹ agbara ati awọn aaye miiran.


HK-04G AD

fidio

ọja Tags

Yipada igbese Abuda

Awọn ẹya ara ẹrọ asọye ti isẹ Parameter iṣẹ Kukuru Awọn ẹya Iye
Ipo ọfẹ FP mm 12.1 ± 0.2
Ipo Iṣiṣẹ OP mm 11.5 ± 0.5
Ipo idasilẹ RP mm 11.7 ± 0.5
Lapapọ ipo irin ajo TTP mm 10.7
Agbara Iṣiṣẹ OF N 1.0 ~ 3.5
Tu silẹ Force RF N -
Total ajo Force TTF N -
Ṣaaju Irin-ajo PT mm 0.3 ~ 1.0
Lori Irin-ajo OT mm 0.2 min
Iyatọ gbigbe MD mm 0.4 ti o pọju

Yipada imọ Abuda

Nkan imọ paramita Iye
1 Itanna Rating 5A/10A 250VAC
2 Olubasọrọ Resistance ≤50mΩIye akọkọ
3 Idabobo Resistance ≥100MΩ500VDC
4 Dielectric Foliteji laarin ti kii-ti sopọ ebute 500V / 0.5mA / 60S
laarin awọn ebute oko ati irin fireemu 1500V/0.5mA/60S
5 Itanna Life ≥10000 iyipo
6 Mechanical Life ≥100000 iyipo
7 Awọn iwọn otutu ti nṣiṣẹ 0 ~ 125℃
8 Igbohunsafẹfẹ Ṣiṣẹ itanna:15awọn iyipoMechanical:60awọn iyipo
9 Ẹri gbigbọn Igbohunsafẹfẹ Igbohunsafẹfẹ: 10 ~ 55HZ;
Iwọn titobi: 1.5mm;
Awọn itọnisọna mẹta: 1H
10 Agbara Solder: Diẹ sii ju 80% ti apakan immersed yoo wa ni bo pelu solder Awọn iwọn otutu tita:235±5℃Immersing Time:2~3S
11 Solder Heat Resistance Soldering Dip: 260± 5℃ 5 ± 1Sọmu onisọpọ: 300± 5℃ 2 ~ 3S
12 Awọn Ifọwọsi Aabo UL, CSA, VDE, ENEC, CE
13 Awọn ipo Idanwo Ibaramu otutu:20±5℃ ibatan
Ọriniinitutu: 65± 5% RH
Agbara afẹfẹ: 86 ~ 106KPa

Ohun elo Yipada: lilo pupọ ni ọpọlọpọ awọn ohun elo ile, ohun elo itanna, ohun elo adaṣe, ohun elo ibaraẹnisọrọ, ẹrọ itanna, awọn irinṣẹ agbara ati awọn aaye miiran.


  • Ti tẹlẹ:
  • Itele:

  • 11

    Kọ ifiranṣẹ rẹ nibi ki o si fi si wa