DK4-BZ-007


DK4-BZ-007

fidio

ọja Tags

(Awọn ẹya asọye ti iṣẹ)

(Parameter Iṣẹ)

(Ikukuru)

(Awọn ẹya)

 pdd

(Ipo Ọfẹ)

FP

mm

(Ipo Iṣiṣẹ)

OP

mm

(Ipo itusilẹ)

RP

mm

(Apapọ Ipo irin ajo)

TTP

mm

(Agbofinro Iṣẹ)

OF

N

(Agbofinro Tu silẹ)

RF

N

(Apapọ agbara irin ajo)

TTF

N

(Irin-ajo Ṣaaju)

PT

mm

(Lori Irin-ajo)

OT

mm

(Iyatọ Iṣipopada)

MD

mm

Yipada imọ Abuda

(Nkan)

(paramita imọ-ẹrọ)

(Iye)

1

(Iwọn Itanna) 10 (1.5) A 250VAC

2

(Olubasọrọ Resistance) ≤50mΩ(Iye akọkọ)

3

(Atako idabobo) ≥100MΩ(500VDC)

4

(Dielectric Foliteji) (laarin awọn ebute ti ko ni asopọ) 500V / 0.5mA / 60S
(laarin awọn ebute ati fireemu irin) 1500V/0.5mA/60S

5

(Igbesi aye Itanna) ≥10000 iyipo

6

(Igbesi aye ẹrọ) ≥3000000 iyipo

7

(Iwọn otutu ti nṣiṣẹ) -25 ~ 105 ℃

8

(Igbohunsafẹfẹ Ṣiṣẹ) (itanna): 15awọn iyipo(Mekaniki):60awọn iyipo

9

(Imudaniloju gbigbọn)

(Igbohunsafẹfẹ Gbigbọn): 10 ~ 55HZ;

(Titobi): 1.5mm;

(Awọn itọnisọna mẹta): 1H

10

(Agbara Solder): (Die sii ju 80% ti apakan immersed yoo wa ni bo pelu solder) (Iwọn otutu tita): 235 ± 5 ℃ (Aago Immersing) :2~3S

11

(Solder Heat Resistance) (Dip Soldering): 260 ± 5 ℃ 5 ± 1S (Afọwọṣe Soldering)

12

(Awọn ifọwọsi Aabo)

UL, CSA, TUV, ENEC

13

(Awọn ipo idanwo) (Iwọn otutu ibaramu): 20 ± 5 ℃ (Ọriniinitutu ibatan) : 65 ± 5% RH

(Atẹgun afẹfẹ): 86 ~ 106KPa


  • Ti tẹlẹ:
  • Itele:

  • 11

    Kọ ifiranṣẹ rẹ nibi ki o si fi si wa