HK-14-1X-16AP-855

Okwangoku: 5(2)A,10(3)A,15A,16(3)A,16(4)A,21(8)A,25A
Voltage: AC 125V/250V, DC 12V/24V
Ivunyiwe: UL, cUL(CSA), VDE,KC,ENEC,CQC


HK-14-1X-16AP-855

Iithegi zeMveliso

HK-14-1X-16AP-855(2)

Iimpawu ezichazayo zokusebenza IParameter yokuSebenza Ixabiso Iiyunithi
Isikhundla sasimahla seFP 15.9±0.2 mm
Isikhundla sokuSebenza i-OP 14.9±0.5 mm
Ukukhulula Isikhundla RP 15.2±0.5 mm
Indawo yohambo iyonke 13.1 mm
Amandla okusebenza OF 0.25~4 N
Ukukhulula amandla RF - N
Unyanzeliso lokuhamba lulonke lwe-TTF - N
Ngaphambi kokuHamba i-PT 0.5~1.6 mm
Ngaphezulu kokuHamba OT 1.0Miz mm
Movement Differential MD 0.4 Ubuninzi mm

Tshintsha iimpawu zobugcisa

INTO ipharamitha yobugcisa Ixabiso
1 Qhagamshelana Ukuchasa ≤30mΩ Ixabiso lokuqala
2 I-Insulation Resistance ≥100MΩ500VDC
3 Umbane weDielectric phakathi kweetheminali ezingadityaniswanga 1000V/0.5mA/60S
phakathi kweetheminali kunye nesakhelo sesinyithi 3000V/0.5mA/60S
4 Ubomi boMbane ≥50000 imijikelo
5 Ubomi boomatshini ≥1000000 imijikelo
6 Ubushushu bokusebenza -25 ~ 125℃
7 Ukuphindaphinda okuSebenzayo zombane:15 imijikelo
Mechanical:60 imijikelo
8 Ubungqina bokungcangcazela UkuVibration Frequency:10 ~ 55HZ;
Ubungakanani: 1.5mm;
Iindlela ezintathu:1H
9 Amandla eSolder: Ngaphezu kwe-80% yenxalenye entywilisiweyo iya kugqunywa ngesolder Soldering Ubushushu:235±5℃
Ixesha lokuntywiliselwa:2~3S
10 I-Solder Heat Resistance Dip Soldering:260±5℃ 5±1S
Ukusoda ngokuManuwali:300±5℃ 2~3S
11 Izamkelo zoKhuseleko UL,CSA,VDE,ENEC,TUV,CE,KC,CQC
12 Iimeko zovavanyo Ubushushu be-Ambient:20±5℃
Ukufuma okuzalanayo: 65±5%RH
Uxinzelelo loMoya: 86 ~ 106KPa

Isicelo sokutshintsha: sisetyenziswa kakhulu kwizixhobo zasekhaya ezahlukeneyo, izixhobo zombane, izixhobo ezizisebenzelayo, izixhobo zonxibelelwano, izixhobo zombane zeemoto, izixhobo zombane kunye namanye amacandelo.


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