HK-04G AZ
Fetola ketso Litšobotsi
| Litšobotsi tse hlalosang ts'ebetso | Parameter e sebetsang | Kgutsufatso | Diyuniti | Boleng |
 | Maemo a Mahala | FP | mm | 12.1±0.2 |
| Boemo ba ho sebetsa | OP | mm | 11.5±0.5 | |
| Ho Lokolla Boemo | RP | mm | 11.7±0.5 | |
| Total travel Position | TTP | mm | 10.7 | |
| Matla a Tshebetso | OF | N | 1.0~3.5 | |
| Ho Lokolla Matla | RF | N | - | |
| Total travel Force | TTF | N | - | |
| Ho Eta Pele | PT | mm | 0.3~1.0 | |
| Ho Feta Maeto | OT | mm | 0.2Metsotso | |
| Phapang ea Motsamao | MD | mm | 0.4Boholo |
Fetola Litšobotsi tsa tekheniki
| ITEM | parameter ea tekheniki | Boleng | |
| 1 | Tekanyetso ea Motlakase | 5A/10A 250VAC | |
| 2 | Ikopanye le Resistance | ≤50mΩBoleng ba pele | |
| 3 | Khanyetso ea Insulation | ≥100MΩ500VDC | |
| 4 | Dielectric Voltage | pakeng tsa li-terminals tse sa amaneng | 500V/0.5mA/60S |
| pakeng tsa ditheminale le foreime ya tshepe | 1500V/0.5mA/60S | ||
| 5 | Bophelo ba Motlakase | ≥10000 lipotoloho | |
| 6 | Bophelo ba Mechini | ≥100000 lipotoloho | |
| 7 | Mocheso oa ho sebetsa | 0 ~ 125℃ | |
| 8 | Maqhubu a Tshebetso | motlakase:15lipotolohoMechini:60lipotoloho | |
| 9 | Bopaki ba Vibration | Maqhubu a ho sisinyeha: 10 ~ 55HZ; Boima: 1.5mm; Litsela tse tharo: 1H | |
| 10 | Bokhoni ba Solder: Ho feta 80% ea karolo e qoelitsoeng e tla koaheloa ka solder | Mocheso oa Soldering:235±5℃Nako ea ho qoelisoa:2~3S | |
| 11 | Solder Heat Resistance | Dip Soldering:260±5℃ 5±1SManual Soldering:300±5℃ 2~3S | |
| 12 | Litumello tsa Tšireletseho | UL,CSA,VDE,ENEC,CE | |
| 13 | Maemo a Teko | Ambient Mocheso:20±5℃Leloko Mongobo: 65±5%RH Khatello ea Moea: 86 ~ 106KPa | |
Sesebelisoa sa switch: se sebelisoa haholo lisebelisoa tse fapaneng tsa ntlo, lisebelisoa tsa elektroniki, lisebelisoa tsa othomathike, lisebelisoa tsa puisano, lisebelisoa tsa elektroniki tsa likoloi, lisebelisoa tsa motlakase le likarolo tse ling.
11
Ngola molaetsa wa hao mona mme o re romele wona
