HK-04G AD

Sesebelisoa sa switch: se sebelisoa haholo lisebelisoa tse fapaneng tsa ntlo, lisebelisoa tsa elektroniki, lisebelisoa tsa othomathike, lisebelisoa tsa puisano, lisebelisoa tsa elektroniki tsa likoloi, lisebelisoa tsa motlakase le likarolo tse ling.


HK-04G AD

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Li-tag tsa Sehlahisoa

Fetola ketso Litšobotsi

Litšobotsi tse hlalosang ts'ebetso Parameter e sebetsang Kgutsufatso Diyuniti Boleng
Maemo a Mahala FP mm 12.1±0.2
Boemo ba ho sebetsa OP mm 11.5±0.5
Ho Lokolla Boemo RP mm 11.7±0.5
Total travel Position TTP mm 10.7
Matla a Tshebetso OF N 1.0~3.5
Ho Lokolla Matla RF N -
Total travel Force TTF N -
Ho Eta Pele PT mm 0.3~1.0
Ho Feta Maeto OT mm 0.2Metsotso
Phapang ea Motsamao MD mm 0.4Boholo

Fetola Litšobotsi tsa tekheniki

ITEM parameter ea tekheniki Boleng
1 Tekanyetso ea Motlakase 5A/10A 250VAC
2 Ikopanye le Resistance ≤50mΩBoleng ba pele
3 Khanyetso ea Insulation ≥100MΩ500VDC
4 Dielectric Voltage pakeng tsa li-terminals tse sa amaneng 500V/0.5mA/60S
pakeng tsa ditheminale le foreime ya tshepe 1500V/0.5mA/60S
5 Bophelo ba Motlakase ≥10000 lipotoloho
6 Bophelo ba Mechini ≥100000 lipotoloho
7 Mocheso oa ho sebetsa 0 ~ 125℃
8 Maqhubu a Tshebetso motlakase:15lipotolohoMechini:60lipotoloho
9 Bopaki ba Vibration Maqhubu a ho sisinyeha: 10 ~ 55HZ;
Boima: 1.5mm;
Litsela tse tharo: 1H
10 Bokhoni ba Solder: Ho feta 80% ea karolo e qoelitsoeng e tla koaheloa ka solder Mocheso oa Soldering:235±5℃Nako ea ho qoelisoa:2~3S
11 Solder Heat Resistance Dip Soldering:260±5℃ 5±1SManual Soldering:300±5℃ 2~3S
12 Litumello tsa Tšireletseho UL,CSA,VDE,ENEC,CE
13 Maemo a Teko Ambient Mocheso:20±5℃Leloko
Mongobo: 65±5%RH
Khatello ea Moea: 86 ~ 106KPa

Sesebelisoa sa switch: se sebelisoa haholo lisebelisoa tse fapaneng tsa ntlo, lisebelisoa tsa elektroniki, lisebelisoa tsa othomathike, lisebelisoa tsa puisano, lisebelisoa tsa elektroniki tsa likoloi, lisebelisoa tsa motlakase le likarolo tse ling.


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