DK4-BZ-019


DK4-BZ-019

video

Li-tag tsa Sehlahisoa

(Litšobotsi tse hlalosang ts'ebetso)

(Parameter e sebetsang)

(Khutsufatso)

(Diyuniti)

 pdd

(Maemo a Mahala)

FP

mm

(Boemo ba Ts'ebetso)

OP

mm

(Boemo ba ho Lokolla)

RP

mm

(Kakaretso ea Maeto)

TTP

mm

(Operating Force)

OF

N

(Releasing Force)

RF

N

(Total travel Force)

TTF

N

(Maeto a Pele)

PT

mm

(Maeto a Felletseng)

OT

mm

(Movement Differential)

MD

mm

Fetola Litšobotsi tsa tekheniki

ITEM

(parameter ea tekheniki)

Boleng

1

(Tlhahiso ea Motlakase) 10(1.5)A 250VAC

2

(Contact Resistance) ≤50mΩ( Boleng ba pele)

3

(Insulation Resistance) ≥100MΩ(500VDC)

4

(Dielectric Voltage) (pakeng tsa li-terminals tse sa hokahaneng) 500V/0.5mA/60S
(pakeng tsa li-terminals le foreimi ea tšepe) 1500V/0.5mA/60S

5

(Bophelo ba Motlakase) ≥10000 lipotoloho

6

(Bophelo ba Mechini) ≥3000000 lipotoloho

7

(Mocheso oa ho sebetsa) -25℃105℃

8

(Makhetlo a ho sebetsa) (motlakase):15lipotoloho(Mechini):60lipotoloho

9

(Bopaki ba Vibration)

(Makhetlo a Vibration): 10 ~ 55HZ;

(Amplitude): 1.5mm;

(Litsela tse tharo): 1H

10

(Bokhoni ba Solder): (Ho feta 80% ea karolo e qoelitsoeng e tla koaheloa ka solder) (Mocheso oa Soldering): 235±5℃(Nako ea ho qoelisoa):2~3S

11

(Solder Heat Resistance) (Dip Soldering): 260±5℃ 5±1S(Manual Soldering):300±5℃ 2~3S

12

(Litumello tsa Tšireletso)

UL, CSA, TUV,ENEC

13

(Maemo a Teko) (Ambient Mocheso):20±5℃ (Mongobo o Relative):65±5%RH

(Khatello ea Moea): 86 ~ 106KPa


  • E fetileng:
  • E 'ngoe:

  • 11

    Ngola molaetsa wa hao mona mme o re romele wona