Renewable Design for China 3.2X4.2mm Miniature Vertical Push Compact Tact Switch SMT/SMD Mounting Push Button Micro Switch

Current: 0.1A, 3A,
Voltage:AC 125V/250V, DC 12V/24V
Approved: UL,cUL(CSA),VDE,ENEC,CQC


Renewable Design for China 3.2X4.2mm Miniature Vertical Push Compact Tact Switch SMT/SMD Mounting Push Button Micro Switch

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The business keeps to the operation concept “scientific management, premium quality and efficiency primacy, customer supreme for Renewable Design for China 3.2X4.2mm Miniature Vertical Push Compact Tact Switch SMT/SMD Mounting Push Button Micro Switch, We have a professional team for international trade. We can solve the problem you meet. We can provide the products you want. Please feel free to contact us.
The business keeps to the operation concept “scientific management, premium quality and efficiency primacy, customer supreme for China Tact Switch, Push Button Switch, Due to the changing trends in this field, we involve ourselves into products trade with dedicated efforts and managerial excellence. We maintain timely delivery schedules, innovative designs, quality and transparency for our customers. Our moto is to deliver quality products within stipulated time.

Switch technical Characteristics

ITEM)

(technical parameter)

(Value)

1

(Electrical Rating)

0.1A 250VAC

2

(Operating Force)

1.0~2.5N

3

(Contact  Resistance)

≤300mΩ

4

(Insulation Resistance)

≥100MΩ(500VDC)

5

(Dielectric Voltage)

(between non-connected terminals)

500V/0.5mA/60S

(between terminals and the metal frame)

1500V/0.5mA/60S

6

(Electrical Life)

≥50000 cycles

7

(Mechanical Life)

≥100000 cycles

8

(Operating Temperature)

-25~105℃

9

(Operating Frequency)

(electrical):15 cycles(Mechanical):60 cycles

10

(Vibration Proof)

(Vibration Frequency):10~55HZ;(Amplitude):1.5mm;(Three directions):1H

11

(Solder Ability)(More than 80% of immersed part shall be covered with solder)

(Soldering Temperature):235±5℃(Immersing Time):2~3S

12

(Solder Heat Resistance)

(Dip Soldering):260±5℃ 5±1SManual Soldering):300±5℃ 2~3S

13

(Test Conditions)

(Ambient Temperature):20±5℃(Relative Humidity):65±5%RH(Air Pressure):86~106KPa


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