HK-04G-LD-025

rarawe iti smd pana patene titi plunger 5a 230v pana moroiti

Inaianei: 1A,5(1)A,10A
Ngaohiko:AC 125V/250V, DC 12V/24V
Whakaaetia: UL,cUL(CSA),VDE,ENEC,CQC


HK-04G-LD-025

Tohu Hua

HK-04G-LD-025-

(Ko nga ahuatanga o te mahi)

(Tawhā Mahi)

(Whakapoto)

(Waeine)

(Uara)

 pd

(Tuhinga Free)

FP

mm

12.1±0.2

(Tuhinga Mahi)

OP

mm

11.5±0.5

(Tuhinga Tuku)

RP

mm

11.7±0.5

(Tuhinga haerenga katoa)

TTP

mm

10.5±0.3

(Ope Mahi)

OF

N

1.0~3.5

(Te Mana Tuku)

RF

N

(Tapeke Ope Haere)

TTF

N

(Hōmua Haerenga)

PT

mm

0.3~1.0

(Mo te Haerenga)

OT

mm

0.2(Min)

(Movement Different)

MD

mm

0.4(Mōrahi)

Hurihia nga ahuatanga hangarau

ITEM

(tawhā hangarau)

Uara

1

(Whakatauranga Hiko) 5(2)A 250VAC

2

(Atete Whakapā) ≤50mΩ( Uara tuatahi)

3

(Atete Wehenga) ≥100MΩ(500VDC)

4

(Ngaohiko Dielectric) (i waenganui i nga kapeka hono kore) 500V/0.5mA/60S

(i waenganui i nga pito me te anga whakarewa) 1500V/0.5mA/60S

5

(Te Ora Hiko) ≥10000 huringa

6

(Te Ora Miihini) ≥100000 huringa

7

(Pamahana Mahi) -25~125℃

8

(Waea Mahi) (hiko):15huringa

(Mīhini):60huringa

9

(Te Wiri Wiri)

(Waea Wiri):10~55HZ;

(Amplitude):1.5mm;

(E toru nga ahunga):1H

10

(Te kaha Solder):(Neke atu i te 80% o te waahanga rumaki ka hipokina ki te solder) (Te Wehenga Soldering):235±5℃

(Wā Rūmaki):2~3S

11

(Atete Wehana Solder) (Tuku Whakakotahi):260±5℃ 5±1S

(Hono A-ringa):300±5℃ 2~3S

12

(Whakaaetanga Haumaru)

UL, CSA, VDE, ENEC, CE

13

(Tuhinga Whakamatau) (Pamahana Ambient):20±5℃

(Hōmākū Pānga):65±5%RH

(Pehanga Rere):86~106KPa


  • Tōmua:
  • Panuku:

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